100-1218-1

CLASSIFICATION

Microcontrollers, Microprocessor, FPGA Modules

manufacturer

BECOM Systems GmbH

type

IC MOD ADSP-BF609 500MHZ X 2

encapsulation

package

Cut Tape (CT)

RoHS

YES

price

available options

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inventory：1647

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specifications

Operating Temperature

-40°C ~ 85°C

Part Status

Active

Co-Processor

Module/Board Type

MPU Core

Flash Size

8MB

RAM Size

256KB

Connector Type

Expansion 2 x 100

Size / Dimension

1.730" L x 1.300" W (44.00mm x 33.00mm)

Core Processor

ADSP-BF609 (Dual Core)

Speed

500MHz x 2